Heat transfer : thermal management of electronics / Younes Shabany
Language: English Publication details: New York : CRC Press, 2010.Description: xv, 491 p. : ill. ; 22 cmISBN:- 9781439814673 (hbk.)
- 621.381 SHA/H
| Cover image | Item type | Current library | Home library | Collection | Shelving location | Call number | Materials specified | Vol info | URL | Copy number | Status | Notes | Date due | Barcode | Item holds | Item hold queue priority | Course reserves | |
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Technical Reference Book
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Central Library, IIT Bhubaneswar | Central Library, IIT Bhubaneswar | SMS | 621.381 SHA/H (Browse shelf(Opens below)) | Available | 11506 |
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| 621.381 SEN/M Microsystem design / | 621.381 SET/E Electroceramic-based MEMS : | 621.381 SHA/D Digital electronic aevam anuprayoog / | 621.381 SHA/H Heat transfer : thermal management of electronics / | 621.381 SHA/I Industrial electronic transducers / | 621.381 SHA/I Industrial electronics and transducers / | 621.381 SHAD Digital electronics and applications / |
Includes bibliographical references and index.
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase.
The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods.
With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.
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