Thermal design of electronic equipment / (Record no. 15514)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01682 a2200241 4500 |
| 001 - CONTROL NUMBER | |
| control field | 11496 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | IN-BhIIT |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20260515120820.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 260426b |||||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9780849300820 (hbk.) |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | IN-BhIIT |
| 041 ## - LANGUAGE CODE | |
| Language code of text | eng |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38104 |
| Book number | REM/B |
| 100 ## - MAIN ENTRY--AUTHOR NAME | |
| Personal name | Remsburg, Ralph |
| Relator term | Author |
| 245 ## - TITLE STATEMENT | |
| Title | Thermal design of electronic equipment / |
| Statement of responsibility, etc | Ralph Remsburg. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | London : |
| Name of publisher | CRC Press, |
| Year of publication | 2000. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 372 p. : |
| Other physical details(ill.) | ill. ; |
| Dimensions(size) | 22 cm. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc | Includes bibliographical references and index. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Electronics, communications engineering  |
| Topical Term | Electronics |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Technical Reference Book |
| Withdrawn status | Lost status | Damaged status | Not for loan | Collection code | Home library | Current library | Date acquired | Source of acquisition | Cost, normal purchase price | Full call number | Accession Number | Cost, replacement price | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Not withdrawn | Not Lost | not damaged | SMS | Central Library, IIT Bhubaneswar | Central Library, IIT Bhubaneswar | 23/04/2026 | 21 | 17241.80 | 621.38104 REM/B | 11496 | 23618.90 | 23/04/2026 | Technical Reference Book |