000			01682 a2200241 4500
001			11496
003			IN-BhIIT
005			20260515120820.0
008			260426b |||||||| |||| 00| 0 eng d
020			_a9780849300820 (hbk.)
040			_aIN-BhIIT
041			_aeng
082			_a621.38104 _bREM/B
100			_aRemsburg, Ralph _eAuthor _927729
245			_aThermal design of electronic equipment / _cRalph Remsburg.
260			_aLondon : _bCRC Press, _c2000.
300			_a372 p. : _bill. ; _c22 cm.
504			_aIncludes bibliographical references and index.
520			_aIn a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
650			_aElectronics, communications engineering  _923582
650			_aElectronics _91277
942			_cTRB
999			_c15514 _d15514