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Advanced materials for thermal management of electronic packaging / by Colin Tong Xingcun.

By: Material type: TextTextPublication details: New York : Springer, 2011.Description: xxi, 616 p. : 24 cmISBN:
  • 9781441977588
Subject(s): DDC classification:
  • 621.381046 22 XIN/A
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Holdings
Item type Current library Home library Call number Status Date due Barcode Item holds
Technical Reference Book Technical Reference Book Central Library, IIT Bhubaneswar Central Library, IIT Bhubaneswar 621.381046 XIN/A (Browse shelf(Opens below)) Available 6898
Total holds: 0

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